Introduction to Dicing Tapes
Dicing Tapes are used in the semiconductor manufacturing process to hold a silicon wafer in place during dicing. Dicing tapes come in two basic varieties, UV and Non-UV. The Non-UV dicing tape is for larger chip sizes while the UV dicing tape generally is used for smaller chip sizes or thinner dies.
The world’s first UV curable dicing tape was developed by FSK Corporation of Japan in 1984. They later changed their name to LINTEC Corporation and are now the largest sellers of UV Curable Dicing Tape worldwide.
Selecting a dicing tape is not always easy in semiconductor manufacturing. While dicing parameters (blade, speed, depth of cut, and RPM) can play a big part in determining cut quality dicing tape does play a role. A dicing tape which is “soft” and “thick” is not a good match for thin dies or brittle devices. It is like dicing on a pillow. Unfortunately almost all tape manufacturers do not list the relatively softness or modulus of the tapes and therefore a user must try several different types to find the type that best fits for the user.
For more information on LINTEC go to http://www.lintec-usa.com/.
The world’s first UV curable dicing tape was developed by FSK Corporation of Japan in 1984. They later changed their name to LINTEC Corporation and are now the largest sellers of UV Curable Dicing Tape worldwide.
Selecting a dicing tape is not always easy in semiconductor manufacturing. While dicing parameters (blade, speed, depth of cut, and RPM) can play a big part in determining cut quality dicing tape does play a role. A dicing tape which is “soft” and “thick” is not a good match for thin dies or brittle devices. It is like dicing on a pillow. Unfortunately almost all tape manufacturers do not list the relatively softness or modulus of the tapes and therefore a user must try several different types to find the type that best fits for the user.
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