There are many varying singulation technologies available and while on the surface singulation of wafers seems straight forward achieving singulation with minimal backside chipping can be quite challenging. As previously noted Dice Before Grind can be used to minimize backside chipping and improve die strength versus the industry standard blade dicing, but other techniques are available and can make sense depending on the device being singulated.
Scribe and Break is a process that does not rely on cutting through the wafer but creating either an internal fracture in the case of Laser Stealth Dicing or dicing a few microns into the top side with a blade or a laser and using an expansion process to expand the wafer so that in breaks along the scribed line or use an anvil to create the same result. Below is an article on the process.
Critical to the success of this process is the tape. The tape itself requires even expansion for two purposes. The first is to allow the dies to singulate. The second is to allow the kerf width (distance between dies) to be consistent in both X and Y directions for subsequent processing. The link below can help recommend a dicing tape for a scribe and break process.
If you have any questions then please feel free to post questions below.
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