Dicing Low-K Materials

Dicing Low-k materials is challenging.  The conventional approach using one or multiple dicing blades created issues of front side chipping or layers would peel away causing device failure.  In an article in 2004 Synova proposed a full cut approach using a laser cooled by water.

ST Micro Synova Water Jet Laser Dicing Article

Below is an example of the results which are quite impressive indeed on a low-K wafer.

ADT and Disco both developed approaches whereby the wafer is grooved with a laser and then the wafer is diced using a mechanical blade.

  

Disco Low-K Dicing

 ADT Low-K Dicing

Low-k materials requires a new approach to singulation.  What is often missed in discussions on singulation is dicing tape.


Dicing tape is more than a "sticky support" for a water jet application the wrong dicing tape will cause dies to fly off and for the groove and dice solution dicing tape plays a critical role as the wrong tape could cause backside chipping or die fly off.  If you have any questions regarding which tape might be right for your process please contact me.

Dicing Tape for Various Applications