On Tuesday my post included information on dicing Low-k wafers; however on Thursday I discovered additional information presented in Semicon China in 2012. I will visit ALSI at Semicon West 2012 to confirm the information contained and to find out more about their technology.
Basically it is a multi-beam technology which will allow for a clean singulation of the top layers. Subsequent singulation can be performed using a standard dicing blade.
The question then becomes which mechanical dicing blade to use and how deep to cut into the tape. As stated in a previous post dicing tape selection is more than simply looking for a tape with high peel strength pre-UV and a low peel strength tape post-UV. Peel strength is a metric which does not tell the whole story. The missing aspects will be the modulus of the tape and tack testing results.
If you would like to learn more about this then please contact me and I would be happy to discuss both aspects and how they relate to dicing tape selection.
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