Advantages:
- Faster cutting speed versus blade dicing
- Less Backside Chipping
- Narrower Kerf (Distance between chips(dies))
o More product per wafer
- Many laser singulation technologies do not use water
Laser Dicing Singulation of Silicon
Stealth Dicing Article
Chip Scale Review Article (pg.26)
Traditional dicing tapes will heat and melt under the temperature generated by the laser and each type of laser dicer requires a different tape depending on the process.
Waterjet Laser Dicing: Porous tape or high adhesion tape.
Full Ablation (Full-Cut) Dicing: Tape which can withstand the energy generated by the laser.
Stealth Dicing: Expandable tape (frontside stealth dicing) or a transparent one for stealth dicing from the backside.
The advantages of laser dicing are compelling; lower CoO through faster throughput, more devices per wafer, and potentially increased die strength, but one must not neglect the role dicing tape plays in this process as laser dicers need to be paired with the right tape to work well.
If you have questions please leave a comment.
Hi,
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The wafer grinding process requires greater accuracy and control capabilities. The feed rate of the wafer is a critical factor that determines the productivity and yield.
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